Dr. David M. Fried is Corporate Vice President of Semiverse™ Solutions at Lam Research. Dr. Fried is responsible for the company’s strategic direction and implementation of software products and algorithms for predictive process modeling and process control. He joined Lam Research in 2017 as a part of Lam’s acquisition of Coventor, where he served as Chief Technology Officer (CTO) for five years. At Coventor, he also led the execution of technology strategy for technology platforms, partnerships, and external relationships.
Fried is a well-respected technologist in the semiconductor industry. He has over 60 patents to his credit and a notable 14-year career with IBM, where he held leadership positions in successive process generations from 65-nanometer through 22-nanometer for IBM’s Systems and Technology Group. His expertise touches upon areas such as Silicon-on-Insulator (SOI), FinFETs, memory scaling, strained silicon, and process variability. He has Bachelors, Masters and Doctoral degrees in Electrical and Computer Engineering from Cornell University. David now lives in northern California with his wife and two daughters and loves to sail, racing a J/70 competitively and cruising in Monterey Bay. He also enjoys cycling, skiing, and traveling.
Session: Chips Making Chips: How Virtualization, Digital Twins and Machine Learning are Accelerating the Spiral of Innovation
Technology, and semiconductor technology in particular, has been advancing at a rapid and accelerating pace since the invention of the transistor over 75 years ago. We’ve now reached the point that “intelligent” manufacturing equipment, powered by advanced chip technology and artificial intelligence, is producing the next generation of computer chips. This has a created a virtuous cycle of innovation, where computer chips and machine learning are helping to produce new, more powerful chips, but even faster and better than before.
In this talk, we will discuss how semiconductor production equipment is becoming “intelligent”, and we’ll review what challenges lie ahead in making this equipment even more intelligent. We will also examine the use of digital twins in the semiconductor industry, and how they are being used to improve productivity in chip manufacturing and in the servicing chip manufacturing equipment. In addition, we will define the concepts of “virtualization” and virtual chip fabrication, and discuss how virtual fabrication is being used in semiconductor design and manufacturing. Finally, we will review a case study that demonstrates how human intelligence and experience can be complimented by machine learning, to further accelerate the spiral of innovation in computer chip technology.
